File:Foil-hgun7.jpg: Difference between revisions

Latest revision as of 03:04, 30 March 2009

7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.

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	Date/Time	Thumbnail	Dimensions	User	Comment
current	02:55, 30 March 2009		2,304 × 1,728 (866 KB)	Linux junkie (talk \| contribs)	7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.

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Soldering a socket on your board

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Camera manufacturer	EASTMAN KODAK COMPANY
Camera model	KODAK EASYSHARE C433 ZOOM DIGITAL CAMERA
Exposure time	1/90 sec (0.011111111111111)
F Number	f/4
ISO speed rating	80
Date and time of data generation	13:18, 29 March 2009
Lens focal length	11.6 mm
Orientation	Normal
Horizontal resolution	480 dpi
Vertical resolution	480 dpi
Software used	Microsoft Windows Photo Gallery 6.0.6001.18000
File change date and time	15:18, 29 March 2009
Y and C positioning	Co-sited
Exposure Program	Normal program
Exif version	2.21
Date and time of digitizing	13:18, 29 March 2009
APEX shutter speed	6.5
APEX aperture	4
APEX exposure bias	0
Maximum land aperture	3.9 APEX (f/3.86)
Metering mode	Center weighted average
Light source	Unknown
Flash	Flash fired, auto mode
Color space	sRGB
Exposure index	80
Sensing method	One-chip color area sensor
Custom image processing	Normal process
Exposure mode	Auto exposure
White balance	Auto white balance
Digital zoom ratio	0
Focal length in 35 mm film	70 mm
Scene capture type	Standard
Contrast	Normal
Saturation	Normal
Sharpness	Normal
Subject distance range	Unknown
Unique image ID	8EB3FAB93B444F859D66D8EB435DEA2F

Revision as of 02:55, 30 March 2009 (view source) Linux junkie (talk \| contribs) (7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.)		Latest revision as of 03:04, 30 March 2009 (view source) Linux junkie (talk \| contribs) No edit summary
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	7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.		7. Blow the heat at an angle to the side of the chip at the solder joints going around the chip in a circle. Never directly on top.
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File:Foil-hgun7.jpg: Difference between revisions

Latest revision as of 03:04, 30 March 2009

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